HCT-F840-LF-C Middle-Sized 8 Zones Hot Air Reflow Soldering Machine
High quality W-F840-LF-C W-F840-LF medium size 8 zone hot air reflow soldering machine for SMT LED production line.
Belongs to category:
Reflow Soldering MachineProduct Description
Technical parameters - 8 Zones Hot Air Reflow Soldering Machine
Model No. | HCT-F840-LF-C | HCT-F840-LF |
Heating Parts Parameters | ||
Number of Heating Zones | Up8 + Bottom8 | Up8 + Bottom8 |
Length of Heating Zones | 2840mm | 2840mm |
Heating Pattern | Up:Hot air; Bottom:Hot air | Up:Hot air; Bottom:Hot air |
(Forced convection of hot air, Taiwan SAYA motor) | (Forced convection of hot air, Taiwan SAYA motor) | |
Number of Cooling Zones | 2 Plasma DC Fan | 2 Plasma DC Fan |
Conveyor Parts Parameters | ||
Max.Width Of PCB | 400mm（stainless steel mesh belt） | 400mm（stainless steel mesh belt） |
Conveyor Direction | L→R | L→R |
Conveyor Height | 880±20mm | 880±20mm |
Transport Mode | Mesh Belt | Mesh Belt |
Conveyor Speed Range | 0-2200mm/min | 0-2200mm/min |
Control Parts Parameters | ||
Power Supply | 5 Wire,3 Phase, 380V 50/60Hz | 5 Wire,3 Phase, 380V 50/60Hz |
Start Power | 30KW | 30KW |
Power Consumption | Approx4-4.5KW | Approx4-4.5KW |
Warming Time | Approx15-20 mins | Approx15-20 mins |
Temp. Setting Range | Room Temp.-380℃ | Room Temp.-380℃ |
Temperature Control Method | Computer-controlled | Instrument-controlled |
TemperatureDifference Between Adjacent Zone | 70 ℃, can correspond to the highest standards of lead-free process. | 70 ℃, can correspond to the highest standards of lead-free process. |
Temperature Control Precision | ±2℃ | ±2℃ |
Temperature Deviation on PCB | ±2℃ | ±2℃ |
Abnormal Alarm | Temperature abnormal（too high or too low after the constant temperature keeping） | Temperature abnormal（too high or too low after the constant temperature keeping） |
Open Way | Manual | Manual |
General Parameters | ||
Dimension(L*W*H)mm | 4250*760*1450MM | 4250*760*1450MM |
Weight | Approx500Kg | Approx500Kg |
High quality W-F840-LF-C W-F840-LF medium size 8 zone hot air reflow soldering machine for SMT LED production line.
Product specification - 8 Zones Hot Air Reflow Soldering Machine
Heating System
Full two-layer distillation booster multi-point jet technology is used to ensure uniform temperature in the oven and good anisotropy in each temperature zone. The board surface is heated without refraction to produce a thermal void area with no shadow.
Fundamentally improve the heating efficiency. Fast and efficient thermal compensation performance is especially suitable for BGA, CSP, QFP, and multilayer circuit boards, such as computer motherboards, cell phone boards, and other components of the perfect weld. No temperature sequence exists for each adjacent temperature zone.
Upper and lower independent heating modules, independent hot air circulation, double soldering zone, or triple soldering zone.
Modular design for each temperature zone; high temperature-resistant long shaft hot air motor; high-energy nichrome electric heating wire; easy maintenance.
Transport system
400-mm-mesh belt type, stepless variable speed with frequency control.
cooling and flux recovery system
The forced cooling system adopts two forced air cooling temperature zones to meet the lead-free process requirements of a smooth cooling curve, no sudden change, sufficient heat exchange, and the highest cooling speed of -5 °C per second.
Filterless design, easy to clean.
Control system
The control system adopts Mitsubishi PLC; the upper computer adopts a Lenovo computer with Windows XP operating system and a 17-inch LCD monitor that is stable and reliable.
Control software is powerful, with flexible process parameter control and temperature curve testing functions. The Chinese and English operation interfaces can be switched at any time.
Use a WOGO terminal; all electrical components are imported brands, and all signal lines are shielded.
The temperature module is self-tuning, the cold end is automatically compensated, and the temperature is controlled within 1°C.