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The Granite platform for SMT pre- and post-reflow inline inspection uses double-sided automatic AOI inspection equipment, which considerably enhances machine precision and stability. RGB+W LED lighting source that is programmable Telecentric lens that responds to high compression with low distortion and constant magnification.
Double-Sided AOI Automatic Optical Inspection Machine
A double-sided AOI machine is a specialized equipment used in electronics manufacturing to automatically inspect both sides of printed circuit boards (PCBs) for defects and inconsistencies. Here's some information about a double-sided AOI automatic optical inspection machine:
Function and Purpose:
Features of a Double-Sided AOI Automatic Optical Inspection Machine:
Advantages of using a Double-Sided AOI Automatic Optical Inspection Machine:
Considerations when using a Double-Sided AOI Automatic Optical Inspection Machine:
Double-sided AOI automatic optical inspection machine offers significant advantages in terms of comprehensive inspection, efficiency, and quality control. By automating the inspection process for both sides of the PCB, these machines contribute to improved product quality, reduced manufacturing costs, and enhanced customer satisfaction.
TECHNICAL PARAMETER - AOI Automatic Inspection Machine Equipment
Model |
HCT-AT510 |
|
PCB Specifications |
Max. PCB size (X x Y) |
510mm x 460mm |
Min. PCB size (Y x X) |
50mm x 50mm |
|
PCB Thickness |
0.6mm~6mm |
|
Board Edge Gap |
3mm |
|
Max. Bottom Gap |
25mm~80 mm Adjustable |
|
Max. Top Gap |
25mm~85 mm Adjustable |
|
PCB Weight |
Belt Drive:≤10Kg;ChainSprocketDrive:≤30Kg |
|
|
After Reflow-soldering |
Chip:wrong parts, missing parts, polarity, offset, tombstone, reverse, damaged, IC bent feet, foreign objects Tin Soldering: No tin, less tin, more tin, bridge, dummy solder, solder ball |
|
AfterWave-soldering |
Chip:wrong parts, missing parts, polarity, offset, tombstone, reverse, damaged, IC bent feet, foreign objects |
DIP:Insert pin, no tin, less tin, more tin, hole, dummy solder, solder ball |
||
Components Range |
Chip:03015 and above;LSI:0.3mm pitch and above;Others:Special shaped component |
|
Inspection Speed |
200~250ms/Fov |
|
MovementMechanism
|
X/Y Drive |
AC Servo Motor |
TrackWidthAdjustmentMethod |
Automatic adjustment +Manual adjustment |
|
Transmission Speed |
1500mm/s(Max) |
|
Transmission Height |
740mm±30mm/900mm±30mm (Optional) |
|
Transmission Direction |
L – R、R – L、L – L、R – R (Pre-factory setting) |
|
Transmission Mode |
Belt drive(Standard); ChainSprocketDrive is optional |
|
Fixed Rail |
Front rail is fixed |
|
PCB Clamping Method |
Edge locking + base plate clamping |
|
ImageParameters |
Camera |
Up Camera:12MP Industrial Camera (USB3.0 high-speed interface) Down Camera:5MP Industrial Camera GigE Vision (Gigabit network interface) |
Resolution |
Up Camera: 10μm Down Camera:5MP:15μm(60mm*49mm) |
|
Lens |
Telecentric Lenses |
|
Lighting System |
Multi-angle surrounding 4-color ring programmable LED light source (RGBW) |
|
Hardware Configure |
Operation System |
Windows 10 Professional Edition 64-bit |
CommunicationMode |
Ethernet,SMEMA |
|
Power Supply |
AC220V±10%,50/60HZ,1.8kVA |
|
Air Supply |
4~6Kg/cm2 |
|
Dimensions |
L(1030mm)×W(1420mm)×H(1550mm)(without alarm lamp height) |
|
Weight |
Approx. 900kg |
|
TemperatureResistance |
Belt drive:≤60℃;Chain Sprocket Drive:≤150℃ |
|
AbsoluteHumidity |
25~80%RH4 |
The Double-sided Automatic AOI Inspection Equipment is for SMT pre-reflow, post-reflow inline inspection Granite platform, greatly improving machine precision and stability Programmable RGB+W LED lighting source Telecentric lens with constant magnification and low distortion response to high compone.
Product Features - AOI Automatic Inspection Machine Equipment
Technical Advantages - AOI Automatic Inspection Machine Equipment
FOV-assisted positioning can accurately locate small components and perform solder joint inspection, and can effectively detect small components and solder joints near high components;
Component-level pad positioning can effectively solve the false alarms and false alarms caused by board bending for flexible boards. FOV positioning is used for non-flexible boards, which can ignore the interference of screen printing and printed lines on the board, and easily realize pad positioning and packaging. detection accuracy;
It is not acceptable for IPC-A-610-G Class 3 component terminations to extend beyond the land by more than 25% of the termination width.
On the basis of precise positioning, it is equipped with special algorithms for hand-plug and machine-plug DIP solder joint inspection. Effective detection of solder joint virtual welding.
Product Display - AOI Automatic Inspection Machine Equipment